A novel packaging process for open-channel sensors

Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Volumn , Issue , 2007, Pages 258-261

  Hsu, Chung Yi ^b   Chen, Lung Tai ^b   Chang, Jin Sheng ^b   Chu, N Hsun ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CLADDING (COATING); ELECTRONIC EQUIPMENT MANUFACTURE; KETONES; LITHOGRAPHY; MICROELECTRONICS; MICROSYSTEMS; OPEN CHANNEL FLOW; PHOTORESISTS; SENSORS; TECHNOLOGY;

COATING PROCESSES; FORMING PROCESSES; PLASTIC PACKAGING; REPRODUCIBILITY; SENSOR PACKAGING;

ELECTRONICS PACKAGING;

EID: 48649108609     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2007.4433612     Document Type: Conference Paper

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