A novel method for packaging of micromachined piezoresistive pressure sensor

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

Volumn , Issue , 2002, Pages 141-144

  Abbaspour Sani, E ^a   Afrang, S ^a   Teymoori, M M ^a  

^a URMIA UNIVERSITY   (Iran)

Author keywords

[No Author keywords available]

Indexed keywords

ANSYS SOFTWARE; APPLIED PRESSURE; AUTOMOTIVE ENGINE; BONDED WIRES; ELASTIC COATING; ELASTIC PROPERTIES; FLIP CHIP TECHNOLOGIES; MECHANICAL MOVEMENTS; MICROMACHINED; PACKAGING COSTS; PACKAGING METHODS; PIEZORESISTIVE PRESSURE SENSORS; SENSOR DIAPHRAGM; SENSOR SENSITIVITY; UNDERFILL MATERIALS; UNDERFILLS; WAFER LEVEL PACKAGING; WIRE BONDING; WIRE BONDING TECHNOLOGY;

CHIP SCALE PACKAGES; COATINGS; DIAPHRAGMS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; KINEMATICS; PRESSURE SENSORS; SEMICONDUCTOR MATERIALS;

PACKAGING;

EID: 51349108334     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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