Development of transfer molding technology for package with die active side partially exposed

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 365-372

  Hock, Eric Kuah Teng ^a   Zong, Zhao Bao ^a   Lee, S G ^a   Ho, S C ^a   Srikanth, N ^a   Zhou, Tiao ^b   Loo, Kum Weng ^b   Hundt, Michael ^b  

^a ASM Technology Singapore Pte Ltd   (Singapore)

^b STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CONTAMINATION; COST EFFECTIVENESS; MOLDING; OPTIMIZATION; RELIABILITY; RISKS; TRANSFER DIES;

MECHANICAL DAMAGE; MOLD FLASH; SURFACE CONTAMINATION; TRANSFER MOLDING TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 0037674935     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Bos, A and Weelden, T., "Film Assisted Molding: Encapsulation Processes for Advanced and Standard Packages", SEMICON Singapore 2002.
2. Eurasem presentation 2002.
3. Zhou, T., "Reliability of Plastic Packages with Partially Encapsulated Die", Proc 13th Symposium on Mechanics of SMT and Photonic Structures, New York, NY, Nov. 2001.
4. Eric Kuah, Henry Sze, et.al, "Encapsulation of 1-Up fpBGA from Design to Production", 27th Annual International Electronics Manufacturing Technology (IEMT) Symposium, San Jose, California USA, July 17-18, 2002.
5. MPET-00-014, "IDEALmold™ Clean Cell Measurement", ASM Internal Report, June 13, 2002.