Packaging effect on MEMS pressure sensor performance

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 2, 2007, Pages 285-293

  Krondorfer, Rudolf H ^a,b   Kim, Yeong K ^c,d  

^a Fjell Industries AS   (Norway)

^b SensoNor asa ^*  (Norway)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^d GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Finite element method (FEM); Micro electro mechanical system (MEMS) package; Packaging stress; Plastic packaging; Viscoelasticity

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MEMS; PRESSURE EFFECTS; PRESSURE SENSORS; STRESSES; THERMAL EFFECTS; VISCOELASTICITY;

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) PACKAGE; PACKAGING STRESS; PLASTIC PACKAGING; SENSOR SIGNAL;

ELECTRONICS PACKAGING;

EID: 34249910325     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.898360     Document Type: Article

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