Packaging of silicon pressure sensors for home appliances

2005 Spanish Conference on Electron Devices, Proceedings

Volumn 2005, Issue , 2005, Pages 589-591

  Campabadal, Francesca ^a   Carreras, Lluís ^a   Arrieta, María Jesús ^b  

^a INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

^b Copreci Soc Coop Ltda ^*  (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL SENSORS; SIGNAL PROCESSING; SILICON;

PACKAGED SENSORS; SENSOR MICROSYSTEMS; SILICON DIE; THERMALLY CURED SILICONE GELS;

ELECTRONICS PACKAGING;

EID: 33745725851     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SCED.2005.1504524     Document Type: Conference Paper

References (12)

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