The effect of epoxy molding compound on thermal/residual deformations and stresses in IC packages during manufacturing process

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 625-635

  Tsai, Ming Yi ^a   Wang, C T ^b   Hsu, C H ^c  

^a CHANG GUNG UNIVERSITY   (Taiwan)

^b Inotera Memories   (Taiwan)

^c ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Chemical shrinkage; Epoxy molding compound (EMC); Manufacturing; Solder reflow; Thermal residual deformations and stresses

Indexed keywords

DEFORMATION; DYNAMIC MECHANICAL ANALYSIS; EPOXY RESINS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; PLASTICS MOLDING; RESIDUAL STRESSES; THERMAL STRESS;

CHEMICAL SHRINKAGE; EPOXY MOLDING COMPOUND (EMC); INTEGRATED CIRCUIT PACKAGES; SOLDER REFLOW; THERMOMECHANICAL ANALYSIS (TMA);

ELECTRONICS PACKAGING;

EID: 33748621485     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.880478     Document Type: Article

References (25)

1. M. Pecht, L. T. Nguyen, and E. B. Hakim, Plastic Encapsulated Microelectronics. New York: Wiley, 1995.
2. J. H. Lau, Thermal Stress and Strain in Microelectronics Packaging. New York: Van Nostrand Reinhold, 1993.
3. R. R. Tummala, Fundamentals of Microsystems Packaging. New York: McGraw-Hill, 2001.
4. G. Kelly, C. Lyden, W. Lawton, and J. Barrett, "Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFP's," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 19, no. 2, pp. 296-300, May 1996.
5. D. J. Monk, Y. He, and D. S. Soane, "Stress in polyimide films during cure and thermal cycling," Manufact. Process. Mater. Challenges Microelectron. Packag., pp. 87-93, 1991.
6. E. H. Wong, K. C. Chan, R. Rajoo, and T. B. Lim, "The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging," in Proc. 50th Electron. Comp. Technol. Conf., 2000, pp. 576-580.
7. M. Uschitsky and E. Suhir, "Moisture diffusion in epoxy molding compounds filled with particles," ASME J. Electron. Packag., vol. 123, pp. 47-51, 2001.
8. H. Ardebili, E. H. Wong, and M. Pecht, "Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 26, no. 1, pp. 206-214, Mar. 2003.
9. E. Stellrecht, B. Han, and M. Pecht, "Measurement of hygroscopic swelling in mold compounds and its effect on PEM reliability," in Proc. Int. Electron. Packag. Tech. Conf. Exhibition (IPACK'03), Maui, HI, Jul. 2003, [CD ROM].
10. F. Su, S. Yi, and K. S. Chian, "Experimental investigation of hygroscopic expansions of molding compounds and plastic IC packages," in Proc. 5th Int. Conf. Electron. Mater. Packag., 2003, pp. 150-157.
11. M. Y. Tsai and C. H. Huang, "Hygrothermal effect on deformations and stresses in QFN packages," in Proc. 5th Int. Conf. Electron. Mater. Packag., 2003, pp. 150-157.
12. S. Nakamura, Y. Miyano, S. Sugnimori, and A. Kaneda, "Thermo-viscoelastic analysis of residual stresses in a thermosetting resin/metal laminated beam caused by cooling," JSME, Int. J. Ser. I, vol. 31, pp. 556-559, 1988.
13. T. S. Yueng and M. M. F. Yuen, "Viscoelastic analysis of IC package warpage," in Proc. Sens., Model. Simul. Emerg. Electron. Packag., ASME Winter Meeting, vol. 17, Atlanta, GA, 1996, pp. 101-108.
14. S. Yi and K. Y. Sze, "Cooling rate effect on post cure stresses in molded plastic IC packages," ASME J. Electron. Packag., vol. 120, pp. 385-390, 1998.
15. K. Miyake, T. Yoshida, G. B. Hyung, and W. P. Sang, "Viscoelastic warpage analysis of surface mount package," ASME J. Electron. Packag., vol. 123, pp. 101-104, 2001.
16. W. D. van Driel, J. H. J. Janssen, G. Q. Zhang, D. G. Yang, and L. J. Ernst, "Packaging induced die stresses-effect of chip anisotropy and time-dependent behavior of a molding compound," ASME J. Electron. Packag., vol. 125, pp. 520-526, 2003.
17. Z. Wu, J. Lu, and Y. Guo, "A study of process-induced residual stress in PBGA packages," ASME J. Electron. Packag., vol. 122, pp. 262-266, 2000.
18. W. Zhang, D. Wu, B. Su, S. A. Hareb, Y. C. Lee, and B. P. Masterson, "The effect of underfill epoxy on warpage in flip chip assemblies," IEEE Trans. Comp. Packag. Technol. A, vol. 21, no. 2, pp. 323-329, Jun. 1998.
19. M. Y. Tsai, C. H. Hsu, and C. T. Wang, "Investigation of thermo-mechanical behaviors of flip chip BGA packages during manufacturing process and thermal cycling," IEEE Trans. Compon. Packag. Technol., vol. 27, no. 3, pp. 568-576, Sep. 2004.
20. D. Post, B. Han, and P. Ifju, High Sensitivity Moiré. New York: Springer-Verlag, 1994.
21. B. Han and Y. Guo, "Application of interferometric techniques to verification of numerical model for microelectronics packaging design," Adv. Electron. Packag., vol. 10-2, pp. 1187-1194, 1995.
22. S. Timoshenko, "Analysis of bi-metal thermostats," J. Opt. Soc. Amer., vol. 11, pp. 233-255, 1925.
23. M. S. Hess, "The end problem for a laminated elastic strip-differential expansion stresses," J. Compos. Mater., vol. 3, pp. 630-641, 1969.
24. E. Suhir, "Stresses in bi-metal thermostats," ASME J. Appl. Mech., vol. 53, pp. 657-660, 1986.
25. M. Y. Tsai and J. Morton, "The stresses in a thermally loaded bi-material interface," Int. J. Solid Struct., vol. 28, no. 8, pp. 1053-1075, 1991.