|
|
|
Volumn , Issue , 1997, Pages 220-222
|
|
Material investigation for pressure sensor package P-DSOF-8-1
a
a
SIEMENS AG
(Germany)
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ADHESION;
COPPER;
CURING;
DIMENSIONAL STABILITY;
ENCAPSULATION;
GELS;
INJECTION MOLDING;
NICKEL PLATING;
SENSORS;
SILICONES;
STRESS ANALYSIS;
SURFACE MOUNT TECHNOLOGY;
ABSOLUTE PRESSURE SENSORS;
ELECTRONICS PACKAGING;
|
|
EID: 0031368099
PISSN: 14029855
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
|
Times cited : (5)
|
|
References (1)
|
