A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach

Sensors and Actuators, A: Physical

Volumn 149, Issue 1, 2009, Pages 165-171

  Chen, Lung Tai ^a,b   Cheng, Wood Hi ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Packaging; Photoresist; Piezoresistive pressure sensor; Transfer molding

Indexed keywords

DAMS; HYDRAULIC STRUCTURES; IMAGE SEGMENTATION; MOLDING; PHOTORESISTORS; PRESSURE; PRESSURE SENSORS; SENSORS; SILICON COMPOUNDS; STRESSES; SURFACE TREATMENT; TRANSFER MOLDING;

EPOXY MOLDING COMPOUNDS; EXPERIMENTAL OBSERVATIONS; HIGH TEMPERATURES; INDUCED STRESSES; LITHOGRAPHIC PROCESSES; MOLDING PROCESSES; OUTPUT VOLTAGES; PACKAGE DESIGNS; PIEZORESISTIVE PRESSURE SENSOR; PLASTIC PACKAGES; SENSING CHANNELS; SILICON MEMBRANES; SMALL PACKAGES; THERMO MECHANICALS;

PRESSURE TRANSDUCERS;

EID: 58149182733     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2008.10.012     Document Type: Article

References (16)

1. Sze S.M. Semiconductor Sensors (1994), John Wiley & Sons pp. 160-189
2. Janczek T. Material investigation for pressure sensor package P-DSOF-8-1. The First IEEE Int. Symposium on Polymeric Electronic Packaging, PEP'97. Norrkoping, Sweden (1997) 220-222
3. Abbaspour-Sani E., Afrang S., and Teymoori M.M. A novel method for packaging of micromachined piezoresistive pressure sensor. Proceedings of the IEEE International Conference on Semiconductor Electronics, ICSE2002. Penang, Malaysia (2002) 141-144
4. Bitko G., Monk D.J., Maudie Th., Stanerson D., Wertz J., Matkin J., and Petrovic S. Analytical techniques for examining reliability and failure mechanisms of barrier coated encapsulated silicon pressure sensors exposed to harsh media. Proceedings of SPIE-The International Society for Optical Engineering, vol. 2882 (1996) 248-258
5. Krondorfer R., Kim Y.K., Kim J., Gustafson C.-G., and Lommasson T.C. Finite element simulation of package stress in transfer molded MEMS pressure sensors. Microelectronics Reliability 44 (2004) 1995-2002
6. Campabadal F., Carreras Ll., and Arrieta M.J. Packaging of silicon pressure sensors for home appliances. Proceedings of the 2005 IEEE Spanish Conference on Electron Devices (2005) 589-591
7. Krondorfer R.H., and Kim Y.K. Packaging effect on MEMS pressure sensor performance. IEEE Transactions on Components and Packaging Technologies 30 (2007) 285-293
8. Krassow H., Campabadal F., and Lora-Tamayo E. Photolithographic packaging of silicon pressure sensors. Sensors and Actuators A 66 (1998) 279-283
9. Cotofana C., Bossche A., Kaldenberg P., and Mollinger J. Low-cost plastic sensor packaging using the open-window package concept. Sensors and Actuators A 67 (1998) 185-190
10. Kuah E., Hock T., Zong Z.B., Lee S.G., Ho S.C., Srikanth N., Zhou T., Loo K.W., and Hundt M. Development of transfer molding technology for package with die active side partially exposed. Proceedings of the Electronic Components and Technology Conference (2003) 365-372
11. Krassow H., Campabadal F., and Lora-Tamayo E. Wafer level packaging of silicon pressure sensors. Sensors and Actuators A 82 (2000) 229-233
12. Tsai M.-Y., Wang C.T., and Hsu C.H. The effect of epoxy molding compound on thermal/residual deformations and stress on IC packaging during manufacturing process. IEEE Transaction on Component and Packaging Technology 29 (2006) 625-635
13. Lee C.-C., Peng C.-T., and Chiang K.-N. Packaging effect investigation of CMOS compatible pressure sensors using flip chip and flex circuit board technologies. Sensors and Actuators A 126 (2006) 48-55
14. Peng C.-T., Lin J.-C., Lin C.-T., and Chiang K.-N. Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology. Sensors and Actuators A 119 (2005) 28-37
15. Xu J., Zhao Y., and Jiang Z. Analysis of the packaging stresses in monolithic multi-sensor. Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Bangkok, Thailand (2007) 241-244
16. Nysether J.B., Larsen A., Liverod B., and Ohlckers P. Measurement of package-induced stress and thermal zero shift in transfer molded silicon piezoresistive pressure sensors. Journal of Micromechanical and Microengineering 8 (1998) 168-171