Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology

Sensors and Actuators, A: Physical

Volumn 119, Issue 1, 2005, Pages 28-37

  Peng, Chih Tang ^a   Lin, Ji Cheng ^a   Lin, Chun Te ^a   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Back side etching; Etching via; Finite element method; Front side etching; Package; Piezoresistive pressure sensor

Indexed keywords

ETCHING; SENSITIVITY ANALYSIS; SHEAR STRESS; SILICON; STRESS ANALYSIS; THERMAL STRESS; THERMOANALYSIS;

BACK-SIDE ETCHING; ETCHING VIA; FRONT-SIDE ETCHING; PACKAGE; PIEZORESISTIVE PRESSURE SENSORS;

SENSORS;

EID: 17144393732     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2004.08.013     Document Type: Article

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