Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

Soldering and Surface Mount Technology

Volumn 21, Issue 2, 2009, Pages 28-38

  Andersson, C ^a   Vandevelde, B ^b   Noritake, C ^b   Sun, P ^a,c   Tegehall, P E ^d   Andersson, D R ^d   Wetter, G ^d   Liu, J ^a,c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b IMEC   (Belgium)

^c SHANGHAI UNIVERSITY   (China)

^d SWEREA IVF   (Sweden)

Author keywords

Finite element analysis; Lead; Modelling; Solders; Stress (materials); Thermal testing

Indexed keywords

FINITE ELEMENT ANALYSIS; MODELLING; SOLDERS; STRESS (MATERIALS); THERMAL TESTING;

CRACK DETECTION; CRACK INITIATION; CRACK PROPAGATION; ELECTRONICS PACKAGING; LEAD; MATERIALS TESTING; RELIABILITY ANALYSIS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; SPIN POLARIZATION; STRESS CORROSION CRACKING; SUBSTRATES; TEST FACILITIES; THERMAL EFFECTS; TIN;

FINITE ELEMENT METHOD;

EID: 70349219926     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910910947453     Document Type: Article

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