Assessment of the reliability of solder joints to ball and column grid array packages for space applications

European Space Agency (Scientific and Technical Memoranda) ESA STM

Volumn , Issue 266, 2001, Pages

  Tegehall, P E ^a   Dunn, B D ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035454343     PISSN: 03794075     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (53)