Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling

Microelectronics Reliability

Volumn 46, Issue 8, 2006, Pages 1348-1356

  Chen, H T ^a,b   Wang, C Q ^a   Li, M Y ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b JIAMUSI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; INTERMETALLICS; LASER APPLICATIONS; METALLIZING; RELIABILITY; THERMAL CYCLING;

INTERGRANULAR CRACKING; LASER SOLDERING; MICRO-CRACKS;

SOLDERED JOINTS;

EID: 33746253822     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.12.001     Document Type: Article

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