MEMS vertical probe cards with ultra densely arrayed metal probes for wafer-level IC testing

Journal of Microelectromechanical Systems

Volumn 18, Issue 4, 2009, Pages 933-941

  Wang, Fei ^a,b   Cheng, Rong ^a   Li, Xinxin ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Dense arrayed vertical tips; Electroplating; IC testing; Micromachining; Probe card

Indexed keywords

ARRAYED PROBES; AUTOMATIC TESTING EQUIPMENTS; CONCAVE CAVITY; CURRENT LEAKAGE; D LINES; DENSE-ARRAYED VERTICAL TIPS; ELECTRIC TESTS; ELECTROPLATED NICKEL; FLIP CHIP; IC TESTING; IN-LINE; LOW TEMPERATURE CO-FIRED CERAMICS; MATERIAL PROPERTY; MATRIX; MECHANICAL TESTS; MEMS FABRICATION TECHNIQUES; MEMS PROBES; METAL PROBES; MICRO-PROBES; MICROMACHINED; PROBE ARRAY; PROBE CARD; SINGLE CRYSTALLINE SILICON; SN-AG SOLDER BUMP; TIP DISPLACEMENT; ULTRADENSE; VERTICAL PROBE; WAFER LEVEL; WAFER LEVEL TESTING;

AUTOMATIC TESTING; COMPOSITE MICROMECHANICS; ELECTRON DEVICE TESTING; ELECTROPLATING; ETCHING; MEMS; METAL TESTING; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MOLDS; NICKEL PLATING; PROBES; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SILVER; SOLDERING; TIN;

LOW TEMPERATURE TESTING;

EID: 68849094395     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2009.2021815     Document Type: Article

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