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IEEE International Test Conference (TC)

Volumn , Issue , 1997, Pages 533-538

  Bates, R Dennis ^a  

^a UPSYS Cerprobe LLC ^*

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE UNDER TEST (DUT); PROBE CARDS;

INTEGRATED CIRCUIT MANUFACTURE; SILICON WAFERS;

INTEGRATED CIRCUIT TESTING;

EID: 0031337925     PISSN: 10893539     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/TEST.1997.639661     Document Type: Conference Paper

References (0)