Contact properties of Ni micro-springs for MEMS probe card

Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts

Volumn , Issue , 2004, Pages 231-235

  Kataoka, Kenichi ^a   Itoh, Toshihiro ^b   Suga, Tadatomo ^b   Inoue, Kazuo ^c  

^a UNIVERSITY OF TOKYO   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

^c JSR CORPORATION   (Japan)

Author keywords

3 dimensional fabrication; Component; Fritting; MEMS Probe Card

Indexed keywords

COPPER; ELECTRIC CONTACTS; ELECTROCHEMICAL ELECTRODES; ELECTROPLATING; FRACTURE TESTING; LSI CIRCUITS; MICROELECTROMECHANICAL DEVICES; SWITCHING CIRCUITS;

3-DIMENSIONAL FABRICATION; COMPONENT; FRITTING; MEMS PROBE CARD;

NICKEL;

EID: 16244383245     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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