Platform for temporary testing of hybrid microsystems at high frequencies

Journal of Microelectromechanical Systems

Volumn 16, Issue 6, 2007, Pages 1367-1377

  Spanier, Gerd ^a   Krüger, Clemens ^b   Schnakenberg, Uwe ^a   Mokwa, Wilfried ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b Automotive Mechatronics GmbH   (Germany)

Author keywords

Composite IC; Coplanar waveguides; Flip chip; High frequency (HF); Known good die (KGD); Micromachining; Microsprings; Multichip module (MCM); Multichip modules

Indexed keywords

COPLANAR WAVEGUIDES; MEMS; MICROMACHINING; MULTICHIP MODULES; NATURAL FREQUENCIES; OPTIMIZATION;

ALUMINA CERAMIC; KNOWN GOOD DIE; MICROSPRINGS; SURFACE-MICROMACHINED MICROSPRINGS;

MICROSYSTEMS;

EID: 36948998581     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2007.904341     Document Type: Article

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