Fabrication and characteristics of MEMS vertical type probe tip for micro sized pads measurement

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2007, Pages 283-286

  Kim, Jin Hyuk ^a,b   Chu, Sung Il ^a   Seo, Ho Won ^a   Ryu, Jae Wook ^a   Kim, Gye Tae ^b   Moon, Sung ^a  

^a Korea Institute of Science and Technology   (South Korea)

^b Korea University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; ELECTRIC DRIVES; ELECTROPLATING; FINITE ELEMENT METHOD; MATERIALS SCIENCE; MECHANICAL ENGINEERING; MECHATRONICS; MEMS; METALLIZING; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; NICKEL; OPTICAL DESIGN; PHOTORESISTS; REACTIVE ION ETCHING; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICES; WAFER BONDING;

CANTILEVER PROBES; CONTACT FORCES; CONTACT-RESISTANCE; FABRICATION PROCESSES; FINITE ELEMENT METHOD FEM; INTERNATIONAL CONFERENCES; MEANDER STRUCTURES; MICRO-ELECTRO MECHANICAL SYSTEMS; MICRO-ELECTRO- MECHANICAL SYSTEM; PROBE DESIGN; PROBE TIPS; SURFACE MICRO-MACHINING; VERTICAL PROBE TIP; WAFER BONDING TECHNOLOGY;

MECHANICS;

EID: 42549146657     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Saotome, Y., Yokote, S., Okamoto, T., and Kinuta, S., "Design and in-situ mechanical testing system for probe card/UV-LIGA-Ni microspring," IEEE The 16th Annual International Conference on, MEMS-03 Kyoto, 2003, pp. 670-673.
2. T. Itoh, K. Kataoka, T. Suga., "Characteristics of low force contact process for MEMS probe card," Sensors and Actuators , Vol 97-98, pp. 462-467, 2002.
3. K. Kataoka, T. Itoh, T. Suga. "Characterization of Fritting Phenomena on Al Electrode for low Contact Force Probe Card," IEEE Trans. Compon., Packag. Manuf. Technol., Vol. 26, No. 2, 2003.
4. Y.M. KIM, H.C. YOON, C.T. SEO, J.H. LEE. "Fabrication of Micro Probe Beam Using MEMS Technology for New Vertical Silicon Probe Card," Japanese Journal of Applied Physics, Vol. 44, NO. 7B, pp5759-5763, 2005.
5. Kataoka, K., Itoh, T., Inoue, K., and Suga, T., "Multi-layer electroplated micro-spring array for MEMS probe card," 17th IEEE international Conference, 2004, pp. 733-736.
6. K.J. Kim, J.Y. Kim, S.H. Jeong, J.S. Kim, and H.M. Lee, "Realization of vertical microprobe arrays for C4 application," 7th Korea MEMS Conference, Korea, April. 2005, pp. 381-384.
7. J.W. Ryu, J.H. Kim, S.I. Chu, Sung Moon, "Fabrication and Mechanical Characterization of MEMS Based Vertical Probe Tips for Micro Sized Pad Measurements," Janpanese Journal of Applied Physics Accepted, 2006.
8. Mark Beiley, Justin Leung, and S. Simon Wong, "A Micromachined Array Probe Card-Characterization," IEEE Trans. Compon., Packag. Manuf. Technol., Vol. 18, No.1, 1995