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Volumn , Issue , 2003, Pages 223-227

Contact properties of micromachined Ni probes

Author keywords

Fritting contact; Micro machined probe card

Indexed keywords

BUCKLING; ELECTRIC RESISTANCE; ELECTRODES; ELECTROPLATING; ETCHING; NICKEL; PROBES; SUBSTRATES; TENSILE STRESS;

EID: 0141904972     PISSN: 03614395     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (9)
  • 3
    • 0033099665 scopus 로고    scopus 로고
    • Thermally actuated microprobes for a new wafer probe card
    • Y. Zhang, Y. Zhang and R. B. Marcus, "Thermally actuated microprobes for a new wafer probe card", J. Microelectromech. Syst. 8, pp. 43-49, 1999.
    • (1999) J. Microelectromech. Syst. , vol.8 , pp. 43-49
    • Zhang, Y.1    Zhang, Y.2    Marcus, R.B.3
  • 6
    • 0009776026 scopus 로고    scopus 로고
    • Characteristics of fritting contacts utilized for micromachined wafer probe cards
    • T. Itoh, T. Suga, G. Engelmann, J. Wolf, O. Ehrmann, H. Reichl, "Characteristics of Fritting Contacts Utilized for Micromachined Wafer Probe Cards", Rev. Sci. Instrum., 71, pp. 2224-2227, 2000.
    • (2000) Rev. Sci. Instrum. , vol.71 , pp. 2224-2227
    • Itoh, T.1    Suga, T.2    Engelmann, G.3    Wolf, J.4    Ehrmann, O.5    Reichl, H.6
  • 7
    • 0036544470 scopus 로고    scopus 로고
    • Characteristics of low force contact process for MEMS probe cards
    • T. Itoh, K. Kataoka and T. Suga, "Characteristics of Low Force Contact Process for MEMS Probe Cards", Sensors and Actuators, A97-98, pp. 462-467, 2002.
    • (2002) Sensors and Actuators , vol.A97-98 , pp. 462-467
    • Itoh, T.1    Kataoka, K.2    Suga, T.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.