Cantilever-type microelectromechanical systems probe card with through-wafer interconnects for fine pitch and high-speed testing

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 6 B, 2004, Pages 3877-3881

  Kim, Bong Hwan ^a,b   Kim, Hyun Chul ^a   Chun, Kukjin ^a   Junghee, Ki ^c   Tak, Yongsug ^c  

^a Seoul National University   (South Korea)

^b Seoul National University   (South Korea)

^c Inha University   (South Korea)

Author keywords

Contact resistance; MEMS probe card; Through wafer interconnection

Indexed keywords

CONTACT RESISTANCES; FINE PITCH; MICROELECTROMECHANICAL SYSTEMS (MEMS) PROBE CARD; REACTIVE ION ETCHING (RIE); THROUGH-WAFE INTERCONNECTION;

CANTILEVER BEAMS; ELASTIC MODULI; ELECTRODEPOSITION; ETCHING; LEAKAGE CURRENTS; NICKEL; SILICON WAFERS; TEST FACILITIES;

MICROELECTROMECHANICAL DEVICES;

EID: 4444368874     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.3877     Document Type: Conference Paper

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