Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 343-346

  Wang, Fei ^a   Li, Xinxin ^a   Cheng, Rong ^a   Yang, Heng ^a   Wang, Yuelin ^a   Feng, Songlin ^a   Ge, Xiaohong ^a   Chen, Tao ^b   Chen, Liguo ^b   Sun, Lining ^b  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; MACHINING; MECHANICAL ENGINEERING; MECHANICAL PROPERTIES; MECHANICS; MECHATRONICS; MEMS; METALLIZING; METALS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; OPTICAL DESIGN; PHOTORESISTS; REACTIVE ION ETCHING; TWO DIMENSIONAL;

CONTACT RESISTANCE VALUES; CURRENT LEAKAGES; ELECTRICAL INTERCONNECTIONS; IC TESTING; INTERNATIONAL CONFERENCES; MICRO PROBES; MICRO-ELECTRO MECHANICAL SYSTEMS; MICROMACHINING TECHNIQUES; PROBE ARRAYS; PROBE TIPS; SPRING CONSTANTS; WAFER LEVELS;

COMPOSITE MICROMECHANICS;

EID: 50149107966     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443663     Document Type: Conference Paper

References (4)

1. B.H. Kim, D.Y. Chung, C.H. Chung, T.U. Chun, S.H. Seok, H.C. Kim, K. Chun, "A vertically guided MEMS probe card with deeply recessed trench-type cantilever," in Proc. IEEE MEMS'05, pp. 271-274, 2005.
2. K. Kataoka, T. Itoh, K. Inoue, T. Suga, "Multi-layer electroplated micro-spring array for MEMS probe card," in Proc. IEEE MEMS'04, pp. 733-736, 2004.
3. J. H. Kim, S. I. Chu, H. W. Seo, J. W. Ryu, G. T. Kim and S. Moon, "Fabrication and characteristics of MEMS vertical type probe tip for micro sized pads measurement," in Proc. IEEE MEMS'07, pp. 283-286, 2007.
4. R. D. Bates, "The search for the universal probe card solution," in Proc. IEEE Int. Test Conf., pp. 533-538, 1997.