Lead free SnAg solder bumping with size sub 100 microns

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2006, Pages

  Lin, Xiaoqin ^a   Zhu, Dapeng ^a   Xu, Gaowei ^a   Luo, Le ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; LEAD; MICROSTRUCTURE; SHEAR STRESS; SURFACE PROPERTIES;

KIRKENDALL VOIDS; REFLOW PROCESS; SHEAR TESTS;

SOLDERING;

EID: 34948849031     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359795     Document Type: Conference Paper

References (10)

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10. Kejun Zeng, Roger Stierman,Tz-cheng Chiu, et al, "Kirkendall Void Formation in Eutectic SnPb Solder Joint on Bare Cu and its Effect on Joint Reliability," Journal of Applied Physics, Vol. 97(2005), pp. 24508/1-8.