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Volumn , Issue , 2000, Pages 805-809
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Overview of MCM/KGD development activities in Japan
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CHIP SCALE PACKAGES;
INTEGRATED CIRCUIT MANUFACTURE;
INTEGRATED CIRCUIT TESTING;
MICROELECTRONICS;
MULTICHIP MODULES;
PRINTED CIRCUIT BOARDS;
TECHNOLOGICAL FORECASTING;
AREA ARRAY PACKAGES;
BURN-IN;
HIGH DENSITY PACKAGING TECHNOLOGY;
KNOWN GOOD DIE;
ELECTRONICS PACKAGING;
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EID: 0034479825
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (6)
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References (1)
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