Simultaneous formation of through wafer electrical interconnects and highly dense & uniform nickel tips for silicon-cantilever probe-cards

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 2051-2054

  Wang, Fei ^a   Li, Xinxin ^a   Wang, Yuelin ^a   Feng, Songlin ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

Electric contact; Electroplated nickel; MEMS probe card; Silicon bulk micromachining

Indexed keywords

ACTUATORS; COMPOSITE MICROMECHANICS; COPPER; COPPER PLATING; ELECTROPLATING; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; NICKEL; NICKEL ALLOYS; NICKEL PLATING; NONMETALS; OPTICAL DESIGN; PHOTORESISTS; RETAINING WALLS; SENSORS; SILICON; TRANSDUCERS;

APPLIED VOLTAGES; BULK MICRO-MACHINING; CONTACT RESISTANCE VALUES; ELECTRIC CONTACT; ELECTROPLATED NICKEL; HIGHLY DENSE; I/O INTERFACES; IC TESTING; INTERNATIONAL CONFERENCES; MEMS PROBE CARD; SILICON BULK MICROMACHINING; SILICON CANTILEVERS; SIMULTANEOUS FORMATION; SOLID-STATE SENSORS; THROUGH WAFER ELECTRICAL INTERCONNECTS; THROUGH-WAFER INTERCONNECTS; WAFER LEVELS;

SILICON WAFERS;

EID: 50049128647     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300567     Document Type: Conference Paper

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