Properties and reliability of SnZn-based lead-free solder alloys

Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC)

Volumn , Issue , 2004, Pages 38-41

  Villain, J ^b   Jillek, W ^a   Schmitt, E ^a   Qasim, T ^b  

^a NUREMBERG INSTITUTE OF TECHNOLOGY   (Germany)

^b AUGSBURG UNIVERSITY OF APPLIED SCIENCES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION; CREEP TESTING; DUCTILITY; ELECTROLESS PLATING; ELECTROMIGRATION; EUTECTICS; INTERMETALLICS; MELTING; METALLIZING; METALLOGRAPHY; MICROELECTROMECHANICAL DEVICES; SOLDERED JOINTS; SURFACE ROUGHNESS; THERMAL CYCLING; TIN COMPOUNDS; WETTING;

CREEP RESISTANCE; LEAD-FREE SOLDER ALLOYS; TIN-LEAD ALLOYS; WETTABILITY;

SOLDERING ALLOYS;

EID: 2342527056     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Habenicht, G., Bergmann, R., Schmitt-Thomas, K. G., Wege, S. "Neue Lote für den automatisierten Lötprozeß", VTE, Vol. 8 (1996), pp. 28-35
2. Poon, N. M., Wu, L. C., Lai, J. K., Chan, Y. C. "Residual Shear Strength of Sn-Ag and Sn-Bi Lead-Free SMT Joints After Thermal Shock", IEEE Transactions on Advanced Packaging, Vol. 23 (2000), pp. 708-714
3. Suganuma, K., Sakai, T., Kim, K.-S., Takagi, Y., Sugumoto, J. And Ueshima, M. "Thermal and Mechanical Stability of Soldering QFP With Sn-Bi-Ag Lead-Free Alloy", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25 (2002). pp. 257-261
4. Villain, J., Brüller, O. S. and Qasim, T., "Creep Behavior of Lead Free and Lead Containing Solder Materials at High Homologous Temperatures with Regard to Small Solder Volumes", E-MRS Spring Meeting 2001, Symposium J, Strasbourg (France), 5.-8.6.2001