Lead-free wave soldering development for PCB assembly

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1829-1838

  Sunappan, Vasudivan ^a   Collier, Peter ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; ELECTRIC RESISTANCE MEASUREMENT; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SOLDERED JOINTS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; TIN ALLOYS;

TEMPERATURE CYCLING TEST; WAVE SOLDERING;

ELECTRONICS PACKAGING;

EID: 0038006003     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. National Center for Manufacturing Sciences (NCMS), "Lead-Free Solder Project", Final Report, 1997. Available at: www.ncms.org
2. Warwick, M., "Implementing Lead Free Soldering - European Consortium Research," SMTA International, 1999, pp. 378-398.
3. Kenichiro, S., "Current Lead-free Soldering Movement in Japan," Proceedings of the 4th International Forum on Jisso Technology, Singapore, November 2000.
4. Alloy Selection Team, "The Lead-Free Assembly Project", National Electronics Manufacturing Initiative, Inc., (NEMI), USA, January 2000, Available at:www.nemi.org
5. Richards, B. and Nimmo, K., "An Analysis of the Current Status of Lead-Free Soldering - Update 2000, DTI(UK 2000). Available at: www.lead-free.org
6. Schlessmann, H., "Lead-free Technology and Necessary Changes in Soldering Process and Machine Technology", APEX 2002, San Diego, USA, pp SO4-1, 1-4.
7. Forsten, A., Steen, H., Wilding, I., Friedrich, J., "Development and validation of lead-free wave soldering process", Soldering & Surface Mount Technology, 12/3, 2000, pp 29-34.
8. Collier P., Sunappan V., Periannan A., "Lead-free Solder Process Implementation for PCB Assembly", Soldering & Surface Mount Technology, No. 14/3, 2002, pp 12-18.
9. Arra, M., et al., "Development of Lead-Free Wave Soldering Process", APEX 2002, San Diego, USA, pp S28-4, 1-10.
10. Bilgari M.H., et al., "Lead-Free Wave Soldering with VOC-Free Fluxes Part 1: Alloy Development Based on SnAgCu, SnBiAg and SnCu, and Process Aspects", IPC Works 2000, Miami, USA, pp S-01-9, 1-10.