Stress induced crystallization of hydrogenated amorphous silicon

Thin Solid Films

Volumn 517, Issue 11, 2009, Pages 3222-3226

  Park, Jungwon ^a   Kwon, Seyeoul ^a   Jun, Seung Ik ^b   Ivanov, Ilia N ^c   Cao, Jinbo ^d   Musfeldt, Janice L ^d   Rack, Philip D ^a  

^a University of Tennessee   (United States)

^b dpiX LLC   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

^d UNIVERSITY OF TENNESSEE   (United States)

Author keywords

Crystallization; Raman spectroscopy; Silicon; Stress induced crystallization; Thin film stress; X ray diffraction

Indexed keywords

AMORPHOUS FILMS; ARCHITECTURAL ACOUSTICS; CRYSTALLIZATION; DIFFRACTION; HYDROGENATION; METALLIC FILMS; MOLECULAR BEAM EPITAXY; NONMETALS; RAMAN SCATTERING; RAMAN SPECTROSCOPY; SEMICONDUCTING SILICON COMPOUNDS; SILICON NITRIDE; SILICON WAFERS; SPECTRUM ANALYSIS; STRENGTH OF MATERIALS; THERMAL EXPANSION; THERMAL STRESS; THERMOELASTICITY; THIN FILM DEVICES; THIN FILMS; X RAY DIFFRACTION;

AMORPHOUS SILICON FILMS; CAPPING LAYERS; COEFFICIENTS OF THERMAL EXPANSIONS; CRYSTALLINITY; HYDROGENATED AMORPHOUS SILICON FILMS; HYDROGENATED AMORPHOUS SILICONS; RADIO FREQUENCY MAGNETRON SPUTTERING; RESIDUAL THERMAL STRESS; SILICON FILMS; STRESS-INDUCED CRYSTALLIZATION; THERMALLY OXIDIZED SILICONS; THIN FILM ARCHITECTURES; THIN FILM STRESS;

AMORPHOUS SILICON;

EID: 62849093372     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.10.114     Document Type: Article

References (34)

1. Ono K., Oikawa S., Konishi N., and Miyata K. Jpn. J. Appl. Phys. 29 (1990) 2705
2. Morozumi S., Oguchi K., Yazawa S., Kodaira T., Ohshima H., and Mano T. SID International Symposium Digest of Technical Papers (May 9-13 1983), Society for Information Display, Philadelphia, U.S.A. 156
3. Spinella C., Lombardo S., and Priolo F. J. Appl. Phys. 84 (1998) 5383
4. Parr A., Gill K., Gardiner D., Holyland J., Sands D., Brunson K., and Carline R. Semicond. Sci. Technol. 17 (2002) 47
5. Pihan E., Slaoui A., Roca P., and Focsa A. Thin Solid Films 451/452 (2004) 328
6. Dimova-Malinovska D., Angelov O., Sendova-Vassileva M., Kamenova M., Pivin J.C., and Pramatarova L. Vacuum 76 (2004) 151
7. Jun S., Yang Y., Lee J., and Choi D. Appl. Phys. Lett. 75 (1999) 2235
8. Wang Z., Wang J., Jeurgens L., and Mittemeijer E. Phys. Rev., B 77 (2008) 045424
9. Wang J., Wang Z., and Mittemeijer E. J. Appl. Phys. 102 (2007) 113523
10. Wang Z., Wang J., Jeurgens L., and Mittemeijer E. Phys. Rev. Lett. 100 (2008) 125503
11. Kim H., Choi J., and Lee J. J. Vac. Sci. Technol., A 17 (1999) 3240
12. Hsiao W., Liu C., and Wang Y. J. Electrochem. Soc. 154 (2007) G122
13. Godet C., Layadi N., and Cabarrocas P. Appl. Phys. Lett. 66 (1995) 3146
14. Hossain M., Abu-Safe H., Naseem H., and Brown W. J. Mater. Res. 21 (2006) 2582
15. Hashemi P., Derekhshandeh J., and Mohajerzadeh S. J. Vac. Sci. Technol., A 22 (2004) 996
16. Moniwa M., Miyao M., Tsuchiyama R., Ishizaka A., Ichikawa M., Sunami H., and Tokuyama T. Appl. Phys. Lett. 47 (1985) 113
17. Kimura Y., Kishi M., and Katoda T. J. Appl. Phys. 86 (1999) 2278
18. Jun S., McKnight T., Melechko A., Simpson M., and Rack P. Appl. Phys. Lett. 87 (2005) 132108
19. Paduschek P., Hopel CH., and Mitlehner H. Thin Solid Films 110 (1983) 291
20. Wang L., Reehal H., Martinez F., Andres E., and Prado A. Semicond. Sci. Technol. 18 (2003) 633
21. Loboda M., and Seifferly J. J. Mater. Res. 11 (1996) 391
22. Martínez F., Prado A., Mártil I., González-Díaz G., Bohne W., Fuhs W., Röhrich J., Selle B., and Sieber I. Phys. Rev., B 63 (2001) 245320
23. Banerji N., Serra J., Chiussi S., Leon B., and Perez-Amor M. Appl. Surf. Sci. 168 (2000) 52
24. Lattemann M., Nold E., Ulrich S., Leiste H., and Holleck H. Surf. Coat. Technol. 174/175 (2003) 365
25. Sahu B., Srivastava P., Sehgal H., and Agnihorti O. Thin Solid Films 415 (2002) 53
26. Teixeira R., Doi I., Zakia M., Diniz J., and Swart J. Mater. Sci. Eng., B 112 (2004) 160
27. French P., Drieenhuizen B., Poenar D., Goosen J., Mallee R., and Wolffenbuttel R. J. Micromech. Syst. 5 (1996) 187
28. Zhang X., Zhang T., Wong M., and Zohar Y. J. Micromech. Syst. 7 (1998) 356
29. Kulikovsky V., Vorlicek V., Bohac P., Stranyanek M., Ctvrtlik R., and Kurdyumov A. Thin Solid Films 516 (2008) 5368
30. Ambree P., Kreller F., Wolf R., and Wandel K. J. Vac. Sci. Technol., B 11 (1993) 614
31. Hughey M., Cook R., and Thurn J. J. Mater. Sci. 40 (2005) 6345
32. Aziz M., Sabin P., and Lu G. Phys. Rev., B 44 (1991) 9812
33. Aziz M., and Zhao Y. Phys. Rev., B 73 (2006) 054101
34. Aziz M. Diffus. Defect Data, Pt. A 153-155 (1998) 1