Stress stability and thermo-mechanical properties of reactively sputtered alumina films

Journal of Materials Science

Volumn 40, Issue 24, 2005, Pages 6345-6355

  Hughey, M P ^a   Cook, R F ^a   Thurn, J ^b  

^a University of Minnesota   (United States)

^b SEAGATE TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA FILMS; STRESS STABILITY;

ALUMINA; CRACK INITIATION; HARDNESS; INDENTATION; RAPID THERMAL ANNEALING; RESIDUAL STRESSES; SPUTTER DEPOSITION; THERMAL CYCLING; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT; TITANIUM CARBIDE;

METALLIC FILMS;

EID: 30844456628     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-005-2070-0     Document Type: Review

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