Second level interconnect mechanical robustness

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference

Volumn , Issue , 2008, Pages 95-100

  Owens, N ^a   Wong, E H ^a   Rajoo, R ^a   Seah, S K W ^a   Selvanayagam, C S ^a   Van Driel, W D ^b   Caers, J F J M ^b   Zhao, X J ^b   Tan, L C ^c   Leoni, M ^c   Eu, P L ^c   Lai, Y S ^d   Yeh, C L ^d  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c FREESCALE SEMICONDUCTOR INC   (United States)

^d ASE Inc   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOARD LEVEL DROP TESTS; ELECTRONIC PRODUCT; MECHANICAL ENVIRONMENT; MECHANICAL ROBUSTNESS; SEMICONDUCTOR COMPONENTS; SEMICONDUCTOR MANUFACTURERS; SEMICONDUCTOR PACKAGES; SYSTEM LEVEL EVALUATION;

CHIP SCALE PACKAGES; EXHIBITIONS; TESTING;

STRESSES;

EID: 84877251769     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)