Fracture mechanics study of fatigue crack growth in solder joints under drop impact

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1601-1605

  Wang, Jason ^a   Seah, S K W ^b   Wong, E H ^c   Cadge, D ^d  

^a INTECSEA   (Canada)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^d DASSAULT SYSTÈMES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK FRONTS; SOLDER JOINTS;

BRAZING; BRITTLENESS; COMPUTER NETWORKS; CRACKING (CHEMICAL); FATIGUE CRACK PROPAGATION; FRACTURE MECHANICS; MECHANICS; MODELS; WELDING;

CRACKS;

EID: 51349151799     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550190     Document Type: Conference Paper

References (14)

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