Constitutive properties of bulk solder at 'drop-impact' strain rates

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 360-364

  Selvanayagam, C S ^a   Wong, E H ^a   Seah, S K W ^a   Van Driel, W D ^b   Caers, J F J M ^c   Zhao, X J ^c   Owens, N ^d   Tan, L C ^d   Frear, D R ^d   Leoni, M ^d   Lai, Y S ^e   Yeh, C L ^e  

^a Institute of Microelectronics

^b NXP SEMICONDUCTORS   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

^d FREESCALE SEMICONDUCTOR INC   (United States)

^e Central Labs

Author keywords

[No Author keywords available]

Indexed keywords

ACCURATE MODELING; AGING CONDITIONS; BULK SOLDERS; CONSTITUTIVE PROPERTIES; DROP IMPACT; GRAIN SIZE VARIATIONS; GRAIN SIZES; MATE RIAL PROPERTIES; MEDIUM STRAIN RATE; PACKAGING TECHNOLOGIES; SOLDER ALLOYS; STRAIN RATE SENSITIVITY;

ALLOYS; BRAZING; DROPS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FLUID MECHANICS; GRAIN SIZE AND SHAPE; METALLIC COMPOUNDS; TECHNOLOGY; WELDING; YIELD STRESS;

STRAIN RATE;

EID: 50049134023     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469817     Document Type: Conference Paper

References (9)

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8. Wong, EH, et. al, "Stress-Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modelling" (2007) Submitted to Journal of Electronic Materials
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