Tri-layer structures subjected to combined temperature and mechanical loadings

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 4, 2008, Pages 790-800

  Wong, E H ^a   Wong, C K ^a,b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Analytical solutions; Drop impact; Electronic packaging; Mechanical bending; Solder joints; Thermal stress

Indexed keywords

ASSEMBLY; BENDING (DEFORMATION); BRAZING; CRYSTALLOGRAPHY; DROPS; DYNAMICS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; PACKAGING; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SOLIDS; STRENGTH OF MATERIALS; STRESSES; THERMAL STRESS; THERMOELASTICITY; WELDING;

ANALYTICAL SOLUTIONS; DROP IMPACT; ELECTRONIC PACKAGING; MECHANICAL BENDING; SOLDER JOINTS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 57349128932     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2001196     Document Type: Article

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