A chemical solution approach to epitaxial metal nitride thin films

Advanced Materials

Volumn 21, Issue 2, 2009, Pages 193-197

  Luo, Hongmei ^a   Lin, Yuan ^b   Wang, Haiyan ^c   Lee, Joon Hwan ^c   Suvorova, Natalya A ^d   Mueller, Alexander H ^a   Burrell, Anthony K ^a   McCleskey, T Mark ^a   Bauer, Eve ^a   Usov, Igor O ^d   Hawley, Marilyn E ^d   Holesinger, Terry G ^a   Jia, Quanxi ^a  

^a LOS ALAMOS NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA   (China)

^c Texas AandM University   (United States)

^d LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTRIC RESISTANCE; EPITAXIAL FILMS; EPITAXIAL GROWTH; GROWTH (MATERIALS); METALLIC FILMS; MOLECULAR WEIGHT; NITRIDES; POLYMER FILMS; POLYMERS; POROUS MATERIALS; SOLID SOLUTIONS; TIN; TITANIUM; TITANIUM COMPOUNDS; TITANIUM NITRIDE; ULTRAFILTRATION;

CHEMICAL SOLUTIONS; METAL ATOMS; ROOM-TEMPERATURE (RT); SMOOTH SURFACES; TI CONTENT;

SURFACE MORPHOLOGY;

EID: 58449109218     PISSN: 09359648     EISSN: None     Source Type: Journal    
DOI: 10.1002/adma.200801959     Document Type: Article

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