Thermomechanical reliability of nickel pillar interconnections replacing flip-chip solder without underfill

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 31, Issue 4, 2008, Pages 341-354

  Aggarwal, Ankur O ^a   Raj, P Markondeya ^a   Lee, Baik Woo ^a   Yim, Myung Jin ^b   Iyer, Mahadevan ^a   Wong, C P ^b   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

Anisotropic conductive film (ACF); Failure analysis; Fine pitch interconnects; Nano structured interconnect; Solder; Thermomechanical reliability

Indexed keywords

ANISOTROPY; BRAZING; CHIP SCALE PACKAGES; CONDUCTIVE FILMS; COPPER; ELECTRIC PROPERTIES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FORMING; MECHANICAL PROPERTIES; NANOSTRUCTURES; NICKEL; NICKEL ALLOYS; OPTICAL INTERCONNECTS; ORGANIC CARBON; QUALITY ASSURANCE; RELIABILITY ANALYSIS; SAFETY FACTOR; SHOCK TESTING; SILICON; SILICON CARBIDE; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; TECHNOLOGY; THERMAL EXPANSION; THERMAL SPRAYING; THERMOMECHANICAL TREATMENT; TIN; WELDING;

ANISOTROPIC CONDUCTIVE FILM (ACF); ANISOTROPIC CONDUCTIVE FILMS; BONDING METHODS; COEFFICIENT OF THERMAL EXPANSIONS; COMPLIANT INTERCONNECTS; DOWNSCALING; ELECTRICAL; ELECTRICAL PROPERTIES; ELECTROPLATING PROCESSES; FINE-PITCH INTERCONNECTS; FINITE-ELEMENT ANALYSES; INCREMENTAL; INTER-CONNECTS; INTERCONNECT STRUCTURES; INTERCONNECT TECHNOLOGIES; INTERCONNECTION TECHNOLOGIES; LOW CTE; LOW MODULUS; MECHANICAL BARRIERS; MECHANICAL REQUIREMENTS; METAL INTERCONNECTS; NANO-STRUCTURED INTERCONNECT; ORGANIC; ORGANIC SUBSTRATES; PACKAGING DENSITIES; RELIABILITY REQUIREMENTS; SIGNIFICANT IMPACTS; SOLDER BUMP INTERCONNECTS; SUBMICROMETER; THERMO-MECHANICAL; THERMOMECHANICAL RELIABILITY; UNDERFILL; UNDERFILLING; WIRE BONDINGS;

RELIABILITY;

EID: 54249119587     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2008.2001974     Document Type: Article

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