Ultrathin soldered flip chip interconnections on flexible substrates

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1244-1250

  Pahl, Barbara ^a   Loeher, Thomas ^a   Kallmayer, Christine ^b   Aschenbrenner, Rolf ^b   Reichl, Herbert ^b  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ASSEMBLY; CHIP SCALE PACKAGES; DEPOSITION; FAILURE ANALYSIS; INTERMETALLICS; METALLIZING; SILICON; SOLDERING; THERMAL CYCLING; ULTRATHIN FILMS;

FLIP CHIP ON FLEX (FCOF) TECHNOLOGY; FOLDED PACKAGES; IMMERSION SOLDER BUMPING (ISB); STENCIL PRINTING;

FLIP CHIP DEVICES;

EID: 10444288777     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Berek, H. et al, "Correlation between the structure and the reliability of different lead free solders", Proc. of Electronic Goes Green 2000+ , Berlin, Germany, Sept. 2000, pp 83-84
2. Xiao, G. et al, "Reliability Study and Failure Analysis of Fine Pitch Solder bumped Flip Chip on Low-Cost Flexible Substrate without Using Stiffener", Proc. of ECTC 2002, San Diego, USA, May 2002, pp 112-118
3. Ostmann, A. et al, "Low Cost Techniques for Flip Chip Soldering", Proc. SMI Conference, September 10-12, 1996, San Jose California, pp 318-326
4. Manessis, D. et al, "Technical Challenges of stencil printing technology for Ultra fine pitch flip chip bumping", Proc. of IMAPS 2002, Denver, USA, Sept. 2002, pp727-732
5. Löher, T. et al, "Ultra fine pitch flip chip technology for semiconductor X-ray detection systems", Proc. of 14th European Microelectronics and Packaging Conference, Friedrichshafen, Germany, 23-25 June 2003, pp 501-505
6. Nieland, S. et al, "Immersion Soldering - a new way for ultra fine pitch bumping", Proc. of Electronic Goes Green 2000+, Berlin, Germany, Sept. 2000, pp165-167
7. Nieland, S. et al, "Immersion Solder Bumping Process Metallurgical Aspects for Process Optimization", Proc. of International Symposium on Advanced Packaging Materials, Atlanta, USA, March 4-6, 2002
8. v.Veen, C et al., "Process options for fine pitch flip chip interconnect" Proc. of IMAPS Europe, Cracow 2002, pp 207-212
9. Pahl, B. et al, "A Thermode Bonding Process for Fine Pitch Flip Chip Applications on Flexible Substrates", Proc. of IMAPS Nordic 2002, Stockholm, Sweden, October 2002, pp 32-38