Development of interconnect technologies for embedded organic packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1484-1489

  Sunohara, Masahiro ^a   Murayama, Kei ^a   Higashi, Mitsutoshi ^a   Shimizu, Mitsuharu ^a  

^a SHINKO ELECTRIC INDUSTRIES CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FLIP CHIP DEVICES; MICROELECTRONIC PROCESSING; MICROPROCESSOR CHIPS; SEMICONDUCTING ORGANIC COMPOUNDS; SEMICONDUCTING SILICON; STRESSES; SUBSTRATES;

EMBEDDED ORGANIC PACKAGES; FACE-UP MOUNTING; FLIP-CHIP MOUNTING; INTERCONNECT TECHNOLOGIES; WAFER THINNING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0038012254     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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