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2
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0033221504
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Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering
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C. E. Ho, Y. M. Chen, and C. R Kao, "Reaction Kinetics of solder-balls with pads in BGA packages during reflow soldering" J. Electronic Materials, Vol. 28, No. 11, pp. 1231-1238, (1999).
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Growth kinetics studies of Cu-Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints
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Y. C. Chan, A. C. K. So, and. J. K. L. Lai, "Growth Kinetics studies of Cu-Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints" Mat. Sci. Eng. B 55, (1998), pp 5-13.
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Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints
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A. C. K So, Y. C. Chan, and J. K. L. Lai, "Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder Joints", IEEE Trans. CMPT, Part B, 20, (1997) pp. 463-469.
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Growth Kinetics of intermetallic compounds in chip scale package solder joint
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P. L. Tu, Y. C. Chan, K. C. Hang, and J. K. L. Lai, "Growth Kinetics of intermetallic compounds in chip scale package solder joint" Scripta Materialia, Volume 44 (2), pp.317-323, 2001.
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Scripta Materialia
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Barrier layer against diffusion
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P. Kay and C. A. McKay, "Barrier layer against diffusion", Trans. Inst. Met. Fin. Vol. 57, (1997), pp. 169.
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Kay, P.1
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7
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Interfacial reaction and wetting behavior in eutectic Sn-Pb solder on Ni/Ti thin films and Ni foils
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P.G. Kim, J. W. Jang, T.Y. Lee, and K. N. Tu, "Interfacial reaction and wetting behavior in eutectic Sn-Pb solder on Ni/Ti thin films and Ni foils" Journal of Applied Physics, Vol. 86, Num-12, (1999), pp 6746-6751.
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Kim, P.G.1
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Tin-lead (Sn-Pb) solder reaction in flip, chip technology
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K. N. Tu and K. Zeng, "Tin-lead (Sn-Pb) solder reaction in flip, chip technology" Materials Science and Engineering R 34 (2001), pp. 1-58
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Materials Science and Engineering R
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Tu, K.N.1
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Thermal fatigue properties of lead-free solders on Cu and NiP under bump metallurgies
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C. Zhang, Jong-Kai. Lin, and Li. Li, "Thermal Fatigue Properties of Lead-free Solders on Cu and NiP Under Bump Metallurgies" 2001 ECTC, pp. 463-470.
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2001 ECTC
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Zhang, C.1
Lin, J.-K.2
Li, L.3
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Lead free flip chip interconnect reliability for DCA and FC-PBGA packages
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J. K Lin, J. W, Jang, S. Hayes, and D. Frear, "Lead free Flip Chip Interconnect Reliability for DCA and FC-PBGA packages" ECTC 2004, pp. 642-648.
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11
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Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
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W.T. Chen, C.E. Ho, and C. R. Kao; "Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders" J. Mater. Res., Vol. 17, No. 2, pp. 263-266, (2002).
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Mulugeta Abtew, Guna Selvaduray, "Lead-free Solders in Microelectronics" Reports: A Review journal, Material Science and Engineering, 27, 95-141 (2000).
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accepted for publication in
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M. N. Islam, Y. C. Chan and A. Sharif, "Interfacial reactions of Sn-Cu and Sn-Pb-Ag Solder with Au/Ni During Extended Time Reflow in Ball Grid Array Packages" accepted for publication in JMR.
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Islam, M.N.1
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14
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Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni
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C. E. Ho, Y. L. Lin, and C. R. Kao, "Strong Effect of Cu Concentration on the reaction between Lead-Free Microelectronic Solders and Ni" Chemistry of materials Vol. 14, number 3, pp. 949-951, (2002).
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Chemistry of Materials
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Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints
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K. S. Kim, S. H. Huh, K. Suganuma, "Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints" Journals and alloy and compounds, 352 (1-2): 226-236, (2003).
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Solder reaction-assisted crystallization of electroless Ni-P under-bump-metallization in low cost flip chip technology
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J. W.Jang P.G. Kim, K.N. Tu, D.R. Frear and P. Thompson, "Solder reaction-assisted crystallization of electroless Ni-P under-bump-metallization in low cost flip chip technology". J. Appl. Phys. 85 12 (1999), pp. 8456-8463.
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Six cases of reliability study of Pb-free solder joints in electronic packaging technology
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K. Zeng and K. N. Tu, "Six cases of reliability study of Pb-free solder joints in electronic packaging technology" Materials Science and Engineering: R: Reports Vol. 38, Issue 2, (2002), pp. 55-105.
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Materials Science and Engineering: R: Reports
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Comparative study of the dissolution kinetics of electrolytic Ni and electroless NiP by the molten Sn3.5Ag0.5Cu solder alloy
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M. N. Islam, Y. C. Chan, A sharif, M. O. Alam, "Comparative study of the dissolution kinetics of electrolytic Ni and electroless NiP by the molten Sn3.5Ag0.5Cu solder alloy" Microelectronics Reliability, 43, 2031-2037, (2003)
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