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Volumn 2005, Issue , 2005, Pages 185-191

Effects of interinetallic compounds on properties of Sn-Cu lead-free soldered joints

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROLYTES; IMPURITIES; INTERFACES (MATERIALS); NICKEL; SHEAR STRENGTH; SOLDERED JOINTS; TIN;

EID: 33745009025     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AGEC.2005.1452342     Document Type: Conference Paper
Times cited : (2)

References (18)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.