Copper interconnections for high performance and fine pitch flipchip digital applications and ultra-miniaturized RF module applications

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 102-111

  Tummala, Rao R ^a   Markondeya Raj, P ^a   Aggarwal, Ankur ^a   Mehrotra, Gaurav ^a   Sau, Wee Koh ^a   Bansal, Shubhra ^a   Tiong, Tan Teck ^b   Ong, C K ^b   Chew, Jimmy ^b   Vaidyanathan, Kripesh ^c   Rao, Vempati Srinivasa ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Advanced Systems Automation Limited (ASA)   (Singapore)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BACK END PROCESSES; COPPER INTERCONNECTIONS; FLIPCHIP DIGITAL APPLICATIONS;

CHIP SCALE PACKAGES; COPPER; ELECTRIC CONDUCTANCE; MICROPROCESSOR CHIPS; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

FLIP CHIP DEVICES;

EID: 33845595319     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645632     Document Type: Conference Paper

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