Anisotropic Conductive Films (ACFs) for ultra-fine Pitch Chip-On-Glass (COG) applications

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 181-186

  Yim, Myung Jin ^a   Hwang, Jinsang ^b   Paik, Kyung Wook ^b  

^a Center for Electronic Packaging Materials (CEPM)   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; ANISOTROPY; ASSEMBLY; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY; ELEMENTARY PARTICLES; OPTIMIZATION; SUBSTRATES;

ANISOTROPIC CONDUCTIVE FILMS (ACF); CHIP-ON-GLASS (COG); COG BONDING; CONDUCTIVE PARTICLES;

THIN FILMS;

EID: 33746579750     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432074     Document Type: Conference Paper

References (8)

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