Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages

Microelectronics Reliability

Volumn 44, Issue 3, 2004, Pages 533-541

  Zhang, Li ^a   Arora, Vivek ^a   Nguyen, Luu ^a   Kelkar, Nikhil ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; CORRELATION METHODS; CRACK PROPAGATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); PASSIVATION; PLASTICITY; SOLDERED JOINTS; STRAIN; STRESS CONCENTRATION; THERMAL EFFECTS;

INELASTIC STRAIN ENERGY; PACKAGE FATIGUE;

SURFACE MOUNT TECHNOLOGY;

EID: 1142263932     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.12.003     Document Type: Article

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