An optimum approach for reduction of fiber alignment shift of fiber-solder-ferrule joints in laser module packaging

Journal of Lightwave Technology

Volumn 22, Issue 2, 2004, Pages 589-594

  Cheng, Wood Hi ^a   Sheen, Maw Tyan ^b   Chang, Chia Ming ^a,c   Tseng, Yih Tun ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b TA INSTRUMENTS   (United States)

^c Philips Semiconductor Kaohsiung   (Taiwan)

Author keywords

Fiber solder ferrule (FSF) joint; Finite element method (FEM); Image capture camera system; Laser module packaging

Indexed keywords

CAMERAS; CREEP; FINITE ELEMENT METHOD; RESIDUAL STRESSES; SEMICONDUCTOR LASERS; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL CYCLING;

FIBER ALIGNMENT SHIFT; FIBER SOLDER FERRULE JOINTS; LASER MODULE PACKAGING;

OPTICAL FIBERS;

EID: 1942486280     PISSN: 07338724     EISSN: None     Source Type: Journal    
DOI: 10.1109/JLT.2004.824462     Document Type: Article

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