Replacement of the drop test with the vibration test - The effect of test temperature on reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 629-637

  Mattila, T T ^a   Suotula, L ^a   Kivilahti, J K ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ANALYSIS; COMPUTER NETWORKS; COPPER; DROPS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FLUID MECHANICS; LATTICE VIBRATIONS; NICKEL ALLOYS; PROTECTIVE COATINGS; RELIABILITY; STATISTICS; VIBRATIONS (MECHANICAL);

DROP TESTING;

TESTING;

EID: 51349127438     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550038     Document Type: Conference Paper

References (30)

1. C.R. Siviour, S. M. Walley, W. G. Proud, and J. E. Field, "Mechanical properties of SnPb and lead-free solders at high rates of strain," Journal of Physics D: Applied Physics, 38, (2005), pp. 4131-4139.
2. th Electronic Components and Technology Conference, June 1 - 4, 2004, Las Vegas, NV, USA, IEEE/EIA CPMT, (2004), pp. 1075-1079.
3. th Electronic Components and Technology Conference, June 1 - 4, 2004, Las Vegas, NV, USA, IEEE/EIA CPMT, (2004), pp. 668-674.
4. P. Ratchev, B. Vandevelde, B. Verlinden, B. Allaert, and D. Werkhoven, "Brittle to ductile fracture transition in bulk Pb-free solders," IEEE Transactions in Components and Packaging Technologies, 30, 3, (2007), pp. 416-423.
5. th Electronic Components and Technology Conference, May 31- June 3, 2005, Lake Buena Vista, FL, IEEE/EIA CPMT, (2005), pp. 1194-1201.
6. th Electronic Components and Technology Conference, May 31- June 3, 2005, Lake Buena Vista, FL, IEEE/EIA CPMT, (2005), pp. 467-471.
7. th Electronic Component and Technology Conference, San Diego, CA, May 30- June 2, 2006, IEEE/EIA CPMT, (2006), pp. 64-71.
8. Y.-S. Lai, H.-C. Chang, and H.-H. Yeh, "Evaluation of solder joint strength under ball impact test," Microelectronics Reliability, 47, (2007), pp. 2179-2187.
9. JESD22-B117, BGA Ball Shear, JEDEC Solid State Technology Association, (2000), 9 p.
10. th Electronics Packaging Technology Conference, 6 - 8 December, 2006, Singapore, IEEE/CPMT, (2006), pp. 701 - 707.
11. nd International Electronic Manufacturing Technology Symposium, October 3-5, 2007, San Jose, CA, USA, IEEE/CPMT, (2007), pp. 233-237.
12. JESD22-B109, Flip Chip Tensile Pull, JEDEC Solid State Technology Association, (2002), 6 p.
13. JESD22-B115, Solder Ball Pull, JEDEC Solid State Technology Association, (2007), 16 p.
14. rd Electronic Components and Technology Conference, New Orleans, LA, USA, May 27-30, 2003, IEEE/EIA CPMT, (2003), pp. 105-112.
15. R. Darveaux, "Shear deformation of lead free solder joints," The Proceedings of the 55th Electronic Components and Technology Conference, May 31- June 3, 2005, Lake Buena Vista, FL, IEEE/EIA CPMT, (2005), pp. 882-893.
16. rd Electronic Components and Technology Conference, New Orleans, LA, USA, May 27-30, 2003, IEEE/EIA CPMT, (2003), pp. 113-120.
17. th Electronic Component and Technology Conference, Lake Buena Vista, FL, May 31- June 3, 2005, IEEE/EIA CPMT, (2005), pp. 645-653.
18. P. Marjamäki, Vibration Test as a New Testing Method for Studying The Mechanical Reliability of Solder Interconnections under Shock Loading Conditions, Doctoral Dissertation, Espoo, 2007, TKK-EPT-17, Otamedia, 128 p.
19. Y. Q. Wang, K. H. Low, F. X. Che H. J. L. Pang, and S. P. Yeo, "Modeling and simulation of printed circuit board drop test," The Proceedings of the 5th Electronic Packaging and Technology Conference, December 10-12, 2003, Singapore, IEEE/CPMT, (2003), pp. 263-268.
20. th Electronic Components and Technology Conference, June 1 - 4, 2004, Las Vegas, NV, USA, IEEE/EIA CPMT, (2004), pp. 1304-1309.
21. th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, June 1 - June 4, 2004, Las Vegas, NV, USA, IEEE/CPMT, (2004), pp. 336-342.
22. T. Y. Tee, J. Luan, E. Pek, C. T. Limb, and Z. Zhong, "Novel numerical and experimental analysis of dynamic responses under board level drop test," The Proceedings of the 5th. International Conference on Thermal and Mechanical Simulation and Experiments in Micro-electronics and Micro-Systems, May 9-12, 2004, Leuven / Brussels, Belgium, IEEE, (2004), pp. 133-140.
23. JESD22-B111, Board level drop test method of components for handheld electronic products, JEDEC Solid State Technology Association, (2003), 16 p.
24. th Electronic Component and Technology Conference, San Diego, CA, May 30- June 2, 2006, IEEE/EIA CPMT, (2006).
25. th Electronic Component and Technology Conference, Reno, NV, May 29- June 1, 2007, IEEE/EIA CPMT, (2007), pp. 381-390.
26. T. T. Mattila and J. K. Kivilahti, "Failure mechanisms of lead-free CSP interconnections under fast mechanical loading", Journal of Electronic Materials, 34, 7, (2005), pp. 969-976.
27. T. T. Mattila, T. Laurila, and J. K. Kivilahti, "Metallurgical factors behind the reliability of high density lead-free interconnections", in E. Suhir, C. P. Wong, and Y. C. Lee, Micro-and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, New York, 2007, (1), Springer Publishing Company, pp. 313-350.
28. T. T. Mattila, P. Marjamäki, and J. K. Kivilahti, "Reliability of CSP components under mechanical shock loading", IEEE Transactions on Components and Packaging Technologies, 29, 4, (2006), pp. 787-795.
29. T. T. Mattila and J. K. Kivilahti, "Reliability lead-free interconnections under consecutive thermal and mechanical loadings", Journal of Electronic Materials, 35, 2, (2006), pp. 250-255.
30. th Electronic Component and Technology Conference, Reno, NV, May 29- June 1, 2007, IEEE/EIA CPMT, (2007), pp. 940-945.