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Volumn , Issue , 2006, Pages 701-707
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High speed ball pull - A predictor of brittle solder joints
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Author keywords
[No Author keywords available]
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Indexed keywords
ALLOYS;
BRAZING;
BRITTLENESS;
CORRELATION METHODS;
DROPS;
ELECTRONIC EQUIPMENT;
ELECTRONIC EQUIPMENT MANUFACTURE;
ELECTRONIC EQUIPMENT TESTING;
ELECTRONICS PACKAGING;
FAILURE ANALYSIS;
FLUID MECHANICS;
FRACTURE;
FRACTURE FIXATION;
FRACTURE TESTING;
IMPACT TESTING;
INTERMETALLICS;
LEAD;
MECHANISMS;
METALLIC COMPOUNDS;
PETROLEUM DEPOSITS;
PETROLEUM RESERVOIRS;
PROBABILITY;
QUALITY ASSURANCE;
RELIABILITY;
RISK ASSESSMENT;
SAFETY FACTOR;
SHOCK TESTING;
SOLDERED JOINTS;
SOLDERING;
SOLDERING ALLOYS;
SPEED;
STATISTICAL METHODS;
STRAIN RATE;
TECHNOLOGY;
TESTING;
WELDING;
BALL SHEAR;
BEND TESTING;
BRITTLE FAILURES;
BULK PROPERTIES;
COOKSON ELECTRONICS;
DATA ANALYSIS;
FAILURE MECHANISMS;
FRACTURE FAILURE;
HIGH SPEEDS;
HIGH STRAIN RATE;
HIGH-TEMPERATURE AGEING;
INTERFACE FRACTURE;
INTERFACIAL FAILURES;
INTERMETALLIC LAYERS;
LEAD-FREE ALLOYS;
LEAD-FREE SOLDERING;
MULTIPLE JOINTS;
MULTIPLE VARIABLES;
PACKAGING TECHNOLOGIES;
PORTABLE ELECTRONIC DEVICES;
REFLOW CONDITIONS;
ROOM TEMPERATURES;
SHOCK DATA;
SOLDER JOINTS;
TIME CONSUMING;
BRITTLE FRACTURE;
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EID: 50249099339
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/EPTC.2006.342799 Document Type: Conference Paper |
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Times cited : (7)
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References (6)
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