Modal and impact analysis of modern portable electronic products

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 645-653

  Tan, L B ^a   Ang, C W ^a   Lim, C T ^a   Tan, V B C ^a   Zhang, Xiaowu ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CELL-PHONES; ELECTRONIC PRODUCTS; IMPACT ANALYSIS; IMPACT FORCES;

ELECTRONICS ENGINEERING; PERSONAL DIGITAL ASSISTANTS; PRINTED CIRCUIT BOARDS; PRODUCT DEVELOPMENT; STRAIN;

ELECTRONICS PACKAGING;

EID: 24644510375     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Lim C.T., Ang C.W., Tan L.B., Seah S.K.W., Wong E.H., "Drop Impact Survey of Portable Electronic Products," IEEE 2003 Electronic Components and Technology Conf, pp. 113-120.
2. Yamaji Y., Suzuki T., Yamasaki H., Ohishi T., Chikawa Y., Kako N., "New Evaluation Method of CSPs board level reliability using strain gauge," IEEE 2000 Electronic Components and Technology Conf. pp. 1398-1404
3. Sogo T. & Hara S. (2001). "Estimation of fall impact strength for BGA solder joints." In: Proceedings of International Conference on Electronics Packaging, pg 369-373.