Development status of high speed ball pull for Pb-free BGA characterization

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2007, Pages 233-237

  Hundt, Paul ^a   Gupta, Vikas ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL SHEAR; BRITTLE FAILURES; ELECTRONICS MANUFACTURING; HIGH SPEEDS; OPERATING WINDOWS; PB-FREE; PEAK FORCES; PRODUCT LIFETIME; RESPONSE VARIABLES; SOLDER BALL PULL TEST; SOLDER BALLS;

BRAZING; ELECTRIC CURRENTS; EQUIPMENT TESTING; FAILURE ANALYSIS; FRACTURE FIXATION; LEAD; QUALITY ASSURANCE; RELIABILITY ANALYSIS; SOLDERING; SPEED; STANDARDS; TECHNOLOGY; TESTING; WELDING;

RELIABILITY;

EID: 48149098197     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2007.4417069     Document Type: Conference Paper

References (13)

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