Transient dynamic simulation and full-field test validation for a slim-PCB of mobile phone under drop / impact

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 914-923

  Park, Seungbae ^a   Shah, Chirag ^a   Kwak, Jae ^a   Jang, Changsoo ^a   Pitarresi, James ^a   Park, Taesang ^b   Jang, Seyoung ^b  

^a State University of New York   (United States)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FULL-FIELD TEST VALIDATION; GLOBAL STRAIN GRADIENTS; NON-CONTACT OPTICAL TECHNIQUE; PRODUCT DURABILITY;

ACCELEROMETERS; COMPUTER SIMULATION; HAND HELD COMPUTERS; MATHEMATICAL MODELS; RELIABILITY; STRAIN GAGES; TRANSIENT ANALYSIS;

MOBILE PHONES;

EID: 35348841459     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373907     Document Type: Conference Paper

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