Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Volumn , Issue , 2007, Pages

  Kaulfersch, Eberhard ^a,b   Rzepka, Sven ^c   Ganeshan, Vijay ^c   Müller, Axel ^c   Michel, Bernd ^a,b  

^a FRAUNHOFER IZM   (Germany)

^b Dept Backend Technologies ^*  (Germany)

^c QIMONDA DRESDEN GMBH AND CO OHG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC MECHANICAL ANALYSIS; FINITE ELEMENT METHOD; ITERATIVE METHODS; MATHEMATICAL MODELS; PARAMETER ESTIMATION; SHEAR DEFORMATION;

FRACTURE MODE; REALISTIC STRESS; SHEAR FORCES; SHEAR SPEED;

SOLDERED JOINTS;

EID: 36348998693     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.360008     Document Type: Conference Paper

References (7)

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