A novel technique for modeling solder joint failure during system level drop simulations

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 861-868

  Carroll, Doug ^a   Bates, Chris ^a   Zampino, Marc ^a   Jones, Kinzy ^a  

^a MOTOROLA INC   (United States)

Author keywords

Dynamic drop testing; Failure analysis; Fasteners; FEM; Lead free; Solder ball modeling

Indexed keywords

FAILURE ANALYSIS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS;

DROP TESTING; LEAD-FREE; SOLDER BALL MODELING;

SOLDERED JOINTS;

EID: 33845584150     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645437     Document Type: Conference Paper

References (6)

1. E.H. Wong, R. Rajoo, Y.W. Mai, S.K.W. Seah, K.T. Tsai, L.M. Yap, "Drop Impact: Fundamentals & Impact Characterization of Solder Joints", Proc. 55th Electronic Components and Technology Conf., 2005.
2. K. Newman, "BGA Brittle Fracture - Alternative Solder Joint Integrity Test Methods", Proc. 55th Electronic Components and Technology Conf., 2005, pp. 1194-1200.
3. D. Reiff, E. Bradley, "A Novel Mechanical Shock Test Method to Evaluate Lead-free EGA Solder Joint Reliability", Proc. 55th Electronic Components and Technology Conf., 2005.
4. J. Huijun, C. Hoe, W. Hua, "Modelling Solder Joint Reliability of BGA Packages Subject to Drop Impact Loading Using Submodelling", ABAQUS Users' Conference, 2002.
5. "ABAQUS Users Manual", Version 6.5, ABAQUS Inc., 2004.
6. D. Carroll, M. Zampino, K. Jones, "Bending Simulation of EGA SMT Assemblies and Application to System Level Drop Simulation", IPACK2005-73475, ASME InterPACK '05, July 17-22, San Francisco, California, USA, 2005.