Lead free assembly impacts on laminate material properties and "Pad Crater" failures

IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

Volumn 2, Issue , 2007, Pages 802-814

  Long, Gary ^a   Embree, Todd ^a   Mukadam, Muffadal ^a   Parupalli, Satish ^a   Vasudevan, Vasu ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN CHANGE; DEVELOPMENT PROCESS; ELECTRONIC PRODUCT; FEATURE SIZES; LAMINATE MATERIALS; LAMINATE PROPERTIES; LEAD-FREE ASSEMBLY; LEAD-FREE PRODUCTS; LEAD-FREE SOLDER JOINT; MECHANICAL MATERIAL PROPERTIES; MECHANICAL MODEL; MECHANICAL SHOCK TESTING; METROLOGY METHODS; SECOND LEVEL; STRESS CONDITION; TEST VEHICLE; THERMAL AND MECHANICAL PROPERTIES; TIN-LEAD;

EXHIBITIONS; FRACTURE; GEOMORPHOLOGY; LEAD; MECHANICAL PROPERTIES; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; TIN;

ASSEMBLY;

EID: 84866929067     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Muffadal Mukadam, Gary Long, Phil Butler, and Vasu Vasudevan, "Impact of Cracking Beneath Solder Pads in Printed Circuit Boards on Reliability of Ball Grid Array Packages", SMTA 2005
2. Shiladitya Paul and James Andrew Curran, "Apparent Modulus of a Composite Beam", University of Cambridge, Department of Materials Science and Metallurgy, Cambridge UK, 1988
3. Renjie Mao and G. Sun, "A Study of the Interaction Between Matrix Crack and Matrix-Fiber Interface", Engineering Fracture Mechanics, Volume 51, Number 3, 1995, pp. 469-477
4. Hseih et al, "Flip Chip Ball Grid Array Component Testing under Board Flexure", Intel Corporation, Hillsboro OR, 2005
5. Gary Shade, "PCB Pad Craters", Intel Lead-Free Symposium, March 15-16, 2006, Scottsdale, AZ
6. Gary Long, "Lead Free Assembly Impacts on Laminate Material Properties and "Pad Crater" Failures", Global PCB Symposium, Oct 13-14, 2006, Shenzhen, China
7. Nikhil Verghese, "PCB Drillability: A Material Science Approach to Resin Development", Circuit World, Volume 30, Number 4, 2004, pp. 44-51(8)
8. Masaki et al, "Effect of Matrix Resin on Delimitation Fatigue Crack Growth in CFRP Laminates", Kyoto University, Kyoto Japan, 1994