Low-cycle fatigue of Ag-Based solders dependent on alloying composition and thermal cycle conditions

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 14-20

  Dudek, Rainer ^a   Faust, Wolfgang ^a   Wiese, Steffen ^a,b   Röllig, Mike ^a,b   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; ALLOYING ELEMENTS; ALLOYS; BRAZING; CREEP; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; METALLIC COMPOUNDS; SILVER; SOLDERING; SOLDERING ALLOYS; TECHNOLOGY; THERMAL CYCLING; WELDING;

CERAMIC CHIP COMPONENTS; CREEP PROPERTIES; CREEP STRAINS; CYCLIC STRESSING; CYCLING CONDITIONS; FATIGUE BEHAVIOR; FATIGUE MODELLING; FATIGUE-LIFE; HIGH STRESS; LEAD-FREE SOLDERING; LOW CYCLE FATIGUES; PACKAGING TECHNOLOGIES; SAC ALLOYS; SOLDER JOINTS; SURFACE FINISHING;

CREEP RESISTANCE;

EID: 50049088805     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469794     Document Type: Conference Paper

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