Impact performance of microvia and buildup layer materials and its contribution to drop test failures

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 391-399

  Xie, Dongji ^a   Wang, Jonathan ^b   Yu, Him ^c   Lau, Dennis ^c   Shangguan, Dongkai ^a  

^a FLEXTRONICS INTERNATIONAL   (United States)

^b Beida Jade Bird Building   (China)

^c Multek Xin Qing Science and Technology   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; DELAMINATION; DYNAMIC RESPONSE; HALOGEN COMPOUNDS;

BUILDUP LAYERS; DROP TEST FAILURES; LASER DRILLABLE; MICROVIA STRUCTURES; PREPREG MATERIALS;

LAMINATES;

EID: 35348910733     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373827     Document Type: Conference Paper

References (4)

1. JESD-B104, Standard Method for Board Level Mechanical Shock Test of Components for Handheld Electronic Systems Application.
2. Dongji Xie, David Geiger, Dongkai Shangguan, Daniel T. Rooney and Louis J. Gullo, "Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)", Proceedings of IPACK05, July 17-22, 2005, San Francisco, CA, USA, IPACK2005-73484
3. Robert Darveaux, Jicheng Yang, Richard Sherida, "RF PA Module Substrate Via Reliability", ECTC 2003, p1181-1189.
4. IEC 60950-1 International Safety Standard for Information Technology Equipment